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Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

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XCZU5EV-1SFVC784E
XCZU5EV-1SFVC784E
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XCZU5EV-1SFVC784E
XCZU5EV-1SFVC784E
AMD Xilinx
IC SOC CORTEX-A53 784FCBGA
System On Chip (SoC)
ds891-zynq-ultrascale-plus-overview.pdf
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9999
IC SOC CORTEX-A53 784FCBGA
9999 In Stock
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Product Attributes
Type PARAMETERS
Primary Attributes
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Base Product Number
XCZU5
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Architecture
MCU, FPGA
Speed
500MHz, 600MHz, 1.2GHz
Number of I/O
252
Product Status
Active
Flash Size
-
Mfr
AMD Xilinx
Package
Tray
RAM Size
256KB
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
784-BFBGA, FCBGA
Series
Zynq® UltraScale+™ MPSoC EV
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supplier Device Package
784-FCBGA (23x23)
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Rm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong Kong
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