XC7Z045-2FFG900CES|Integrated Circuits (ICs) suppliers

Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

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XC7Z045-2FFG900CES

Product Name XC7Z045-2FFG900CES

Manufacturer AMD Xilinx

Describe IC SOC CORTEX-A9 800MHZ 900FCBGA

Classification: System On Chip (SoC)

Datesheet ds190-Zynq-7000-Overview
ds191-XC7Z030-XC7Z045-data-sheet
ug933-Zynq-7000-PCB

Stock 9999

Customer Reference

IC SOC CORTEX-A9 800MHZ 900FCBGA

9999 In Stock

More quantities are on the way.

Product Attributes

Type PARAMETERS

Peripherals

DMA

Base Product Number

XC7Z045

Primary Attributes

Kintex™-7 FPGA, 350K Logic Cells

Package / Case

900-BBGA, FCBGA

RAM Size

256KB

Mfr

AMD Xilinx

Operating Temperature

0°C ~ 85°C (TJ)

Package

Tray

Product Status

Obsolete

Flash Size

-

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Supplier Device Package

900-FCBGA (31x31)

Number of I/O

130

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Series

Zynq®-7000

Architecture

MCU, FPGA