Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

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BSW-130-24-G-M
BSW-130-24-G-M
Favorite Products
BSW-130-24-G-M
BSW-130-24-G-M
Samtec Inc.
CONN RCPT 30POS 0.1 GOLD PCB
9999
CONN RCPT 30POS 0.1 GOLD PCB
9999 In Stock
More quantities are on the way.
Product Attributes
Type PARAMETERS
Package
Bulk
Contact Material
Phosphor Bronze
Operating Temperature
-55°C ~ 125°C
Connector Type
Receptacle, Breakaway
Contact Type
Female Socket
Number of Rows
1
Contact Length - Post
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Mated Stacking Heights
-
Ingress Protection
-
Current Rating (Amps)
-
Contact Shape
Square
Product Status
Obsolete
Number of Positions
30
Voltage Rating
-
Number of Positions Loaded
All
Mfr
Samtec Inc.
Series
BSW
Contact Finish - Mating
Gold
Insulation Color
Black
Style
Board to Board
Row Spacing - Mating
-
Contact Finish Thickness - Mating
20.0µin (0.51µm)
Applications
-
Pitch - Mating
0.100" (2.54mm)
Mounting Type
Through Hole, Bottom Mount
Insulation Height
0.350" (8.89mm)
Insulation Material
Polyethylene Terephthalate (PET), Glass Filled
Contact Finish Thickness - Post
-
Fastening Type
Push-Pull
Contact Finish - Post
Tin
Features
-
Termination
Solder
Base Product Number
BSW-130
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