5CSEMA6U23C6N|Integrated Circuits (ICs) suppliers

Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

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5CSEMA6U23C6N

Product Name 5CSEMA6U23C6N

Manufacturer Intel

Describe IC SOC CORTEX-A9 925MHZ 672UBGA

Classification: Embedded - System On Chip (SoC)

Datesheet cv_51002.pdf
cv_5v3.pdf
cv_51001.pdf
ug_virtualjtag.pdf

Stock 9999

Customer Reference

IC SOC CORTEX-A9 925MHZ 672UBGA

9999 In Stock

More quantities are on the way.

Product Attributes

Type PARAMETERS

Speed

925MHz

Series

Cyclone® V SE

RAM Size

64KB

Primary Attributes

FPGA - 110K Logic Elements

Operating Temperature

0°C ~ 85°C (TJ)

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Supplier Device Package

672-UBGA (23x23)

Base Product Number

5CSEMA6

Package / Case

672-FBGA

Mfr

Intel

Package

Tray

Flash Size

-

Architecture

MCU, FPGA

Number of I/O

MCU - 181, FPGA - 145

Product Status

Active

Peripherals

DMA, POR, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG