Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

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558-10-360M19-001104
558-10-360M19-001104
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558-10-360M19-001104
558-10-360M19-001104
Preci-Dip
BGA SURFACE MOUNT 1.27MM
IC Sockets
9999
BGA SURFACE MOUNT 1.27MM
9999 In Stock
More quantities are on the way.
Product Attributes
Type PARAMETERS
Pitch - Mating
0.050" (1.27mm)
Product Status
Active
Termination
Solder
Mfr
Preci-Dip
Package
Bulk
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Operating Temperature
-55°C ~ 125°C
Material Flammability Rating
UL94 V-0
Number of Positions or Pins (Grid)
360 (19 x 19)
Mounting Type
Surface Mount
Current Rating (Amps)
1 A
Contact Finish - Mating
Gold
Termination Post Length
0.086" (2.20mm)
Features
Closed Frame
Pitch - Post
0.050" (1.27mm)
Type
BGA
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Series
558
Contact Material - Mating
Brass
Contact Material - Post
Brass
Housing Material
FR4 Epoxy Glass
Contact Resistance
10mOhm
Base Product Number
558-10
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