1SX280LN3F43E1VG|Integrated Circuits (ICs) suppliers

Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

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1SX280LN3F43E1VG

Product Name 1SX280LN3F43E1VG

Manufacturer Intel

Describe IC SOC CORTEX-A53 1.5GHZ 1760BGA

Classification: Embedded - System On Chip (SoC)

Datesheet s10-overview.pdf
s10_datasheet.pdf

Stock 9999

Customer Reference

IC SOC CORTEX-A53 1.5GHZ 1760BGA

9999 In Stock

More quantities are on the way.

Product Attributes

Type PARAMETERS

Flash Size

-

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

Mfr

Intel

Product Status

Active

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Primary Attributes

FPGA - 2800K Logic Elements

Series

Stratix® 10 SX

Speed

1.5GHz

Operating Temperature

0°C ~ 100°C (TJ)

Supplier Device Package

1760-FBGA, FC (42.5x42.5)

Package

Tray

RAM Size

256KB

Number of I/O

688

Architecture

MCU, FPGA

Package / Case

1760-BBGA, FCBGA

Peripherals

DMA, WDT