1SX250HN3F43I3XG|Integrated Circuits (ICs) suppliers

Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

Favorite Products

1SX250HN3F43I3XG

Product Name 1SX250HN3F43I3XG

Manufacturer Intel

Describe IC FPGA STRATIX 10 1760FBGA

Classification: System On Chip (SoC)

Datesheet s10-overview.pdf?wapkw=stratix+10+sx

Stock 9999

Customer Reference

IC FPGA STRATIX 10 1760FBGA

9999 In Stock

More quantities are on the way.

Product Attributes

Type PARAMETERS

Peripherals

DMA, WDT

Mfr

Intel

Series

Stratix® 10 SX

Architecture

MCU, FPGA

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Supplier Device Package

1760-FBGA (42.5x42.5)

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Product Status

Active

Operating Temperature

-40°C ~ 100°C (TJ)

Package

Tray

Primary Attributes

FPGA - 2500K Logic Elements

Speed

1.5GHz

Package / Case

1760-BBGA, FCBGA