1SX110HN3F43I3VG|Integrated Circuits (ICs) suppliers

Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdAbout UsRm 705, 7/F, Fa Yuen Comm Bldg, No. 75-77, Fa Yuen Street, Mong Kok, Kln, Hong KongHeadquartered in Shenzhen, China with branch in Hong Kong, China, Hong Kong Yatexin Electronics Co., Ltd. is recommended to be a leader and innovator in professional distribution of Electronic Components. We specialized in providing passive board level components to OEMs and CEMs. Luckvenie has been always customer-driven and quality focused. We offer a wide selection of electronic components in stock with 24/7 order processing and rapid delivery.Hong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin Electronics Co., LtdHong Kong Yatexin

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1SX110HN3F43I3VG

Product Name 1SX110HN3F43I3VG

Manufacturer Intel

Describe IC FPGA STRATIX 10 1760FBGA

Classification: Embedded - System On Chip (SoC)

Datesheet s10-overview.pdf?wapkw=stratix+10+sx

Stock 9999

Customer Reference

IC FPGA STRATIX 10 1760FBGA

9999 In Stock

More quantities are on the way.

Product Attributes

Type PARAMETERS

Product Status

Active

Speed

1.5GHz

Mfr

Intel

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1760-BBGA, FCBGA

Flash Size

-

Peripherals

DMA, WDT

Package

Tray

Architecture

MCU, FPGA

Primary Attributes

FPGA - 1100K Logic Elements

Series

Stratix® 10 SX

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

RAM Size

256KB

Supplier Device Package

1760-FBGA (42.5x42.5)

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™